International collaboration EU and Japan on semiconductors
DIGITAL-JU-CHIPS-2026-SG-JAPAN · DIGITAL-JU-SIMPLE · TRL 5 to 7
What this call funds
This call funds joint EU and Japan research projects on advanced semiconductor packaging and chiplet technologies, including 2.5D and 3D integration and integrated photonics for AI applications. Projects should move from lab demonstrations to pilot line verification in real semiconductor manufacturing use cases. The goal is to strengthen European industry through standardised chiplet interfaces and stronger interoperability across the ecosystem.
semiconductors · advanced manufacturing · artificial intelligence · photonics
Who wins this
This call suits industry and research consortia working on chiplet and heterogeneous integration technologies who can collaborate with Japanese partners and validate their work in pilot manufacturing environments.
Could you win this call?
Only the website is required.
The call in detail
- Indicative grant size
- €3M to €5M
- Funding model
- DIGITAL-AG
- Submission
- Single-stage submission (full proposal at once)
- Type of action
- DIGITAL JU Simple Grants
- Partners
- Not stated in the call.
- Also required
- Detailed eligibility, admissibility, and evaluation conditions are defined in Appendix 8 of the Chips for Europe Initiative Work Programme rather than in this call text.
- Sectors
- AI/ML · Cybersecurity · Deep Tech
Read the full conditions from the official call ›
Conditions 1. Admissibility conditions: Proposal page limit and layout described in Appendix 8 of Work Programme - Chips for Europe Initiative call document. Proposal page limits and layout: described in Part B of the Application Form available in the Submission System. 2. Eligible countries described in Appendix 8 of Work Programme - Chips for Europe Initiative. 3. Other eligibility conditions Appendix 8 of Work Programme - Chips for Europe Initiative. 4. Financial and operational capacity and exclusion described Appendix 8 of Work Programme - Chips for Europe Initiative. 5a. Evaluation and award: Submission and evaluation processes described Appendix 8 of Work Programme - Chips for Europe Initiative and the Online Manual. 5b. Evaluation and award: Award criteria, scoring and thresholds described Appendix 8 of Work Programme - Chips for Europe Initiative. 5c. Evaluation and award: Indicative timeline for evaluation and grant agreement described in Appendix 8 of Work Programme - Chips for Europe Initiative. 6. Legal and financial set-up of the grants described Appendix 8 of Work Programme - Chips for Europe Initiative. Call Details Call document and annexes: Model Grant Agreements (MGA) DEP MGA